Suspension assembly having a microactuator electrically connected to a gold coating on a stainless steel surface

ABSTRACT

A novel suspension assembly includes a suspension assembly mounting plate, a microactuator mounting structure extending from the suspension assembly mounting plate, a load beam extending from the microactuator mounting structure, and a laminated flexure attached to the load beam. The laminated flexure includes a tongue that has a read head bonding surface. The suspension assembly includes a stainless steel surface having a gold coating, and a piezoelectric microactuator attached to the microactuator mounting structure and electrically connected to the gold coating.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to the field of informationstorage devices, and more particularly to microactuators and suspensionassemblies that are used to position read heads in information storagedevices.

2. Background of the Art

Information storage devices are used to retrieve and/or store data incomputers and other consumer electronics devices. A magnetic hard diskdrive is an example of an information storage device that includes oneor more heads that can both read and write, but other informationstorage devices also include heads—sometimes including heads that cannotwrite. For convenience, all heads that can read are referred to as “readheads” herein, regardless of other devices and functions the read headmay also perform (e.g. writing, flying height control, touch downdetection, lapping control, etc).

In a modern magnetic hard disk drive device, each read head is asub-component of a head gimbal assembly (HGA). The read head typicallyincludes a slider and a read/write transducer. The read/write transducertypically comprises a magneto-resistive read element (e.g. so-calledgiant magneto-resistive read element, or a tunneling magneto-resistiveread element) and an inductive write structure comprising a flat coildeposited by photolithography and a yoke structure having pole tips thatface a disk media.

The HGA typically also includes a suspension assembly that includes amounting plate, a load beam, and a laminated flexure to carry theelectrical signals to and from the read head. The read head is typicallybonded to a tongue feature of the laminated flexure. The HGA, in turn,is a sub-component of a head stack assembly (HSA) that typicallyincludes a plurality of HGAs, a rotary actuator, and a flex cable. Themounting plate of each suspension assembly is attached to an arm of therotary actuator (e.g. by swaging), and each of the laminated flexuresincludes a flexure tail that is electrically connected to the HSA's flexcable (e.g. by solder bonding).

Modern laminated flexures typically include electrically conductivecopper traces that are isolated from a stainless steel support layer bya polyimide dielectric layer. So that the signals from/to the head canreach the flex cable on the actuator body, each HGA flexure includes aflexure tail that extends away from the head along the actuator arm andultimately attaches to the flex cable adjacent the actuator body. Thatis, the flexure includes electrically conductive traces that areelectrically connected to a plurality of electrically conductive bondingpads on the head, and extend from adjacent the head to terminate atelectrical connection points at the flexure tail.

The position of the HSA relative to the spinning disks in a disk drive,and therefore the position of the read heads relative to data tracks onthe disks, is actively controlled by the rotary actuator which istypically driven by a voice coil motor (VCM). Specifically, electricalcurrent passed through a coil of the VCM applies a torque to the rotaryactuator, so that the read head can seek and follow desired data trackson the spinning disk.

However, the industry trend towards increasing areal data density hasnecessitated substantial reduction in the spacing between data tracks onthe disk. Also, disk drive performance requirements, especiallyrequirements pertaining to the time required to access desired data,have not allowed the rotational speed of the disk to be reduced. Infact, for many disk drive applications, the rotational speed has beensignificantly increased. A consequence of these trends is that increasedbandwidth is required for servo control of the read head positionrelative to data tracks on the spinning disk.

One solution that has been proposed in the art to increase disk driveservo bandwidth is dual-stage actuation. Under the dual-stage actuationconcept, the rotary actuator that is driven by the VCM is employed as acoarse actuator (for large adjustments in the HSA position relative tothe disk), while a so-called “microactuator” having higher bandwidth butlesser stroke is used as a fine actuator (for smaller adjustments in theread head position). Various microactuator designs have been proposed inthe art for the purpose of dual-stage actuation in disk driveapplications. Some of these designs utilize one or more piezoelectricmicroactuators that are affixed to a stainless steel component of thesuspension assembly (e.g. the mounting plate or an extension thereof,and/or the load beam or an extension thereof, and/or an intermediatestainless steel part connecting the mounting plate to the load beam).

However, if the microactuator is electrically connected to a stainlesssteel surface of the suspension assembly (e.g. for grounding), anelectrochemical reaction may cause an oxidation layer to form on thestainless steel at the connection location. The oxidation layer may beinsulative and interfere with desired electrical conduction, and may beexacerbated by hot and humid conditions. Over time, the desired responseof the microactuator to applied signals may become diminished, leadingto reduced or impaired performance of the information storage deviceand/or data loss.

Therefore, there is a need in the information storage device arts for asuspension assembly design that can improve integration with amicroactuator (e.g. piezoelectric micro actuator).

SUMMARY

A novel suspension assembly includes a suspension assembly mountingplate, a microactuator mounting structure extending from the suspensionassembly mounting plate, a load beam extending from the microactuatormounting structure, and a laminated flexure attached to the load beam.The laminated flexure includes a tongue that has a read head bondingsurface. The suspension assembly includes a stainless steel surfacehaving a gold coating, and a microactuator attached to the microactuatormounting structure and electrically connected to the gold coating.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is top view of a disk drive capable of including an embodiment ofthe present invention.

FIG. 2 is a bottom perspective view of a head gimbal assembly (HGA)capable of including an embodiment of the present invention.

FIG. 3 is an expanded view of the region labeled 3 in FIG. 2.

FIG. 4 is a top perspective view of a suspension assembly according toan embodiment of the present invention, after placement of themicroactuator but before electrical connection of the microactuator.

FIG. 5 is an expanded view of the region labeled 5 in FIG. 4.

FIG. 6 is an expanded view of the region labeled 5 in FIG. 4, exceptafter electrical connection of the microactuator.

FIG. 7 is an expanded view of the region labeled 5 in FIG. 4, exceptbefore placement of the microactuator.

FIG. 8 is a top plan view of a suspension assembly component thatincludes a mounting plate and a microactuator mounting structure,according to an embodiment of the present invention.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

FIG. 1 is top view of a disk drive 100 that is capable of including anembodiment of the present invention. The disk drive 100 includes a diskdrive base 102. The disk drive 100 further includes a spindle 106,rotably mounted on the disk drive base 102, for rotating a disk 104 thatis mounted on the spindle 106. The rotation of the disks 104 establishesair flow through optional recirculation filter 108. In certainembodiments, disk drive 100 may have only a single disk 104, oralternatively, two or more disks.

The disk drive 100 further includes a rotary coarse actuator 110 that isrotably mounted on disk drive base 102. The rotary coarse actuator 110includes an actuator arm 114 that supports a head gimbal assembly (HGA)118. Voice coil motor 112 rotates the actuator 110 through a limitedangular range so that the HGA 118 may be desirably positioned relativeto one or more tracks of information on the disk 104. Preferably thedisk drive 100 will include one HGA 118 per disk surface, butdepopulated disk drives are also contemplated in which fewer HGAs areused. Under non-operating conditions the HGAs may be parked on ramp 120,for example to avoid contact with the disk 104 when it is not spinning.Electrical signals to/from the HGA 118 are carried to other driveelectronics, in part via a flex cable (not shown) and a flex cablebracket 116.

FIG. 2 is a bottom perspective view of an HGA 200 that is capable ofincluding an embodiment of the present invention. Now referringadditionally to FIG. 2, the HGA 200 includes a load beam 202, and a readhead 210 for reading and writing data from and to a magnetic disk (e.g.disk 104). The read head 210 includes a slider substrate having an airbearing surface (the label 210 points to this surface) and an opposingtop surface (not visible in the view of FIG. 2). The slider substratepreferably comprises AlTiC, although another ceramic or silicon mightalso be used. The slider substrate of the read head 210 also includes atrailing face 212 that includes a read/write transducer (too small to bepractically shown in the view of FIG. 2, but disposed on the trailingface 212). In certain embodiments, the read/write transducer ispreferably an inductive magnetic write transducer merged with amagneto-resistive read transducer. The purpose of the load beam 202 isto provide limited vertical compliance for the read head 210 to followvertical undulations of the surface of a disk (e.g. disk 104 of FIG. 1)as it rotates, and to preload the air bearing surface of the read head210 against the disk surface by a preload force that is commonlyreferred to as the “gram load.”

In the embodiment of FIG. 2, the HGA 200 also includes a laminatedflexure 204 attached to the load beam 202. The laminated flexure 204includes a tongue 206 that has a read head bonding surface. The head 210is attached to the read head bonding surface of the tongue 206 of thelaminated flexure 204. Only a portion of the tongue 206 is visible inthe view of FIG. 2 because the read head 210 partially obscures it. Afirst purpose of the laminated flexure 204 is to provide compliance forthe head 210 to follow pitch and roll angular undulations of the surfaceof the disk (e.g. disk 104) as it rotates, while restricting relativemotion between the read head 210 and the load beam 202 in the lateraldirection and about a yaw axis. A second purpose of the laminatedflexure 204 is to provide a plurality of electrical paths to facilitatesignal transmission to/from the read head 210. For that second purpose,the laminated flexure 204 includes a plurality of electricallyconductive traces 218 that are defined in an electrically conductive(e.g. copper) sub-layer of the laminated flexure 204. Electricallyconductive traces 218 are isolated from a support layer (e.g. stainlesssteel) by a dielectric layer (e.g. polyimide).

In the embodiment of FIG. 2, the load beam 202 includes hinge plates 222and 224, and is attached to a mounting plate 220 via the hinge plates222 and 224 and a microactuator mounting structure 300. These componentsmay be made of stainless steel, and their attachments to each other maybe made by a plurality of spot welds, for example. Alternatively, theload beam 202 may have integral hinge plate regions rather than beingassembled with separate hinge plate components, so that the load beam202 and its hinge plates would be a single component having materialcontinuity.

The load beam 202 with its hinge plates 222, 224 (if any), themicroactuator mounting structure 300, and the mounting plate 220, maytogether be referred to as a “suspension assembly.” Accordingly, themounting plate 220 may also be referred to as a suspension assemblymounting plate 220. In certain preferred embodiments, the suspensionassembly mounting plate 220 includes a swage boss 226 to facilitateattachment of the suspension assembly to an actuator arm (e.g. actuatorarm 114). In that case, the suspension assembly mounting plate 220 mayalso be referred to as a “swage mounting plate.” Note that, after thelaminated flexure 204 is attached to the load beam 202, the laminatedflexure 204 may be considered to also pertain to the “suspensionassembly.” However, before the laminated flexure 204 is attached to theload beam 202, the term “suspension assembly” may refer to only the loadbeam 202 with its hinge plates 222, 224 (if any), and the mounting plate220.

FIG. 3 is an expanded view of the region of the HGA 200 that is labeled3 in FIG. 2. Now referring additionally to FIG. 3, a microactuatormounting structure 300 is seen to extend from the suspension assemblymounting plate 220. In the embodiment of FIG. 3, the microactuatormounting structure 300 is seen to be a separate sub-component that isattached to the suspension assembly mounting plate 220 (e.g. by aplurality of spot welds). However, alternatively the microactuatormounting structure 300 and the suspension assembly mounting plate 220may be a single component having material continuity rather than beingan assembly of subcomponents.

The microactuator mounting structure 300 may include at least onecompliant arm 310 so that the microactuator can move a distal portion318 relative to an anchored portion 316 of the microactuator mountingstructure 300. For example, in the embodiment of FIG. 3, themicroactuator mounting structure 300 includes two compliant arms 310 and312, so that the microactuator mounting structure encompasses a window314. The window 314 is dimensioned so that it can be spanned bymicroactuator 330. Alternatively, however, the microactuator mountingstructure 300 can be designed to have a single compliant arm (e.g.centered on a longitudinal axis of the suspension assembly) so that themicroactuator mounting structure 300 would be generally I-shaped betweendistal and root portions. Such embodiments may have two microactuatorson either side of the I-shape that span the distance from the distalportion to the root portion.

In the embodiment of FIG. 3, the load beam 202 extends from the distalportion 318 of the microactuator mounting structure 300, in that theload beam 202 includes the hinge plates 222 and 224 that are attached toand extend from the distal portion 318 of the microactuator mountingstructure 300. In alternative embodiments, the hinge plates 222, 224 andthe load beam 202 can be a single component having material continuity(rather than being an assembly of subcomponents as shown in FIG. 3).

FIG. 4 is a top perspective view of a suspension assembly 400 accordingto an embodiment of the present invention, after placement of amicroactuator 430 but before electrical connection of the microactuator430. In the embodiment of FIG. 4, the suspension assembly 400 includes aload beam 402 and a laminated flexure 404 attached to the load beam 402.The load beam 402 includes hinge plates 422 and 424, and is attached toa suspension assembly mounting plate 420 via the hinge plates 422 and424. These components may be made of stainless steel, and theirattachments to each other may be made by spot welding, for example.Alternatively, the load beam 402 may have integral hinge plate regionsrather than being assembled with separate hinge plate components, sothat the load beam 402 and its hinge plates would be a single componenthaving material continuity. In certain preferred embodiments, thesuspension assembly mounting plate 420 includes a swage boss 426 tofacilitate attachment of the suspension assembly to an actuator arm(e.g. actuator arm 114).

FIG. 5 is an expanded view of the region of the suspension assembly 400that is labeled 5 in FIG. 4. Now referring additionally to FIG. 5, thesuspension assembly mounting plate 420 can be seen to include amicroactuator mounting structure 500 extending from the suspensionassembly mounting plate 420. In the embodiment of FIG. 5, themicroactuator mounting structure 500 includes a partially etched well540 into which the microactuator 430 may be placed. In certain preferredembodiments, the microactuator 430 is adhered to the microactuatormounting structure 500 by an adhesive (e.g. UV cured epoxy, thermal setepoxy, etc), and such adhesive or another encapsulate material may bedisposed around the periphery of the microactuator 430 and within thepartially etched well to help prevent particle shedding.

In the embodiment of FIG. 5, the microactuator mounting structure 500includes at least one compliant arm 510 so that the microactuator 430can move a distal portion 518 relative to an anchored portion 516 of themicroactuator mounting structure 500. For example, in the embodiment ofFIG. 5, the microactuator mounting structure 500 includes two compliantarms 510 and 512, so that the microactuator mounting structureencompasses a window 514. The window 514 is dimensioned so that it canbe spanned by microactuator 430. Alternatively, however, themicroactuator mounting structure 500 can be designed to have a singlecompliant arm so that the microactuator mounting structure 500 would begenerally I-shaped between distal and root portions. Such embodimentsmay have two microactuators on either side of the I-shape that span thedistance from the distal portion to the root portion.

In the embodiment of FIG. 5, the load beam 402 extends from the distalportion 518 of the microactuator mounting structure 500, in that theload beam 402 includes the hinge plates 422 and 424 that are attached toand extend from the distal portion 518 of the microactuator mountingstructure 500. In alternative embodiments, the hinge plates 422, 424 andthe load beam 402 can be a single component having material continuity(rather than being an assembly of subcomponents as shown in FIG. 5). Inthe embodiment of FIG. 5, the distal portion 518 of the microactuatormounting structure 500 may optionally include a adhesive-limiting trench570 to help prevent adhesive from reaching (and potentially undesirablyaffecting the structural characteristics of) the hinge plates 422, 424.

In the embodiment of FIG. 5, the microactuator mounting structure 500 ofthe suspension assembly 400 includes a stainless steel surface havingtwo regions 550 and 552 that are coated with gold. Alternatively, one ormore gold coatings can be disposed on a stainless steel surface of thesuspension assembly mounting plate 420 outside but adjacent the anchoredportion 516 of the microactuator mounting structure 500. Alternatively,a gold coating may be disposed on a stainless steel surface of each ofthe hinge plates 422, 424, outside but adjacent the distal portion 518of the microactuator mounting structure 500. In either of thesealternative embodiments, what is desired is that the gold coatings bedisposed near enough to the microactuator 430 to facilitate electricalconnection thereto. Preferably but not necessarily, the two gold-coatedregions 550 and 552 of the stainless steel surface of the microactuatormounting structure 500 include partial etched trenches 560 and 562,respectively.

In the embodiment of FIG. 5, the microactuator 430 includes topelectrodes 432 and 436, separated by an isolation region 434. However,in the view of FIG. 5, the top electrodes 432 and 436 are notelectrically connected to the two gold-coated regions 550 and 552 of thestainless steel surface of the microactuator mounting structure 500. Incertain preferred embodiments, the microactuator 430 is a piezoelectricmicroactuator that is polarized differently beneath the top electrode432 than it is beneath the top electrode 436, to facilitate differentialmotion despite the application of a common electrical field from acommon bottom electrode (not shown). In certain other embodiments, themicroactuator is a piezoelectric microactuator that is polarizedsimilarly beneath the top electrode 432 and the top electrode 436, withdifferential motion being created by the application of different oropposite voltages to one opposing bottom electrode (not shown) versusanother.

FIG. 6 is an expanded view of the region labeled 5 in FIG. 4 (of thesuspension assembly 400), except after electrical connection of the topelectrodes 432 and 436 of the microactuator 430 to the two gold-coatedregions 550 and 552 of the stainless steel surface of the microactuatormounting structure 500. FIG. 7 is an expanded view of the region labeled5 in FIG. 4 (of the suspension assembly 400), except before placement ofthe microactuator 430.

Specifically, and now referring additionally to FIGS. 6 and 7, the topelectrodes 432 and 436 of the microactuator 430 have been electricallyconnected to the two gold-coated regions 550 and 552 of the stainlesssteel surface of the microactuator mounting structure 500, by beads 650and 652 of epoxy adhesive that is doped with silver particles.Alternatively, solder or gold wire stitching may be used to make theelectrical connections. However, if solder is used and the microactuatoris a piezoelectric microactuator, then it may be desirable for thesolder to be a low temp-melting-point since it should not need to get sohot that the piezoelectric material (e.g. PZT) is depolarized.

In certain embodiments, the gold coating in gold-coated regions 550 and552 may advantageously diminish or prevent an electrochemical reactionthat could cause an undesirable oxidation layer to form on the stainlesssteel surface at the connection locations, and thereby improve thereliability of the electrical connections. Note that the partial etchedtrenches 560 and 562 may also improve the reliability of the electricalconnection of the top electrodes 432 and 436 of the microactuator 430 tothe two gold-coated regions 550 and 552.

In certain embodiments, the microactuator may include two piezoelectricelements, each connected to at least one of the plurality of conductivetraces (e.g. conductive traces 218). In such embodiments, eachpiezoelectric element can be separately or differently energized tocreate a desired motion of the distal portion of the microactuatormounting portion relative to the anchor portion thereof. In anotherembodiment, the microactuator includes one piezoelectric element (asshown in FIG. 5) having bottom electrodes that are electricallyconnected to two of the plurality of conductive traces. In such anembodiment, a different voltage can be applied to different portions ofthe piezoelectric element to create a desired motion of the distalportion of the microactuator mounting portion relative to the anchorportion thereof. In a preferred embodiment, the microactuator 430includes one piezoelectric element having a common bottom electrode thatis electrically connected to only a single one of the plurality ofconductive traces (with the top electrode or electrodes connected toground via the suspension assembly stainless steel structure). In suchan embodiment, the piezoelectric element is preferably polarizeddifferently beneath one surface electrode versus another, to facilitatedifferential motion despite the application of a common voltage from thesingle conductive trace. Note that in the aforementioned embodiments,the side of the piezoelectric microactuator that is grounded may begrounded via connection to the stainless steel parts of the suspensionassembly (used as the ground conductor rather than or in addition to aground trace of the laminated flexure).

FIG. 8 is a top plan view of a suspension assembly component 800according to an embodiment of the present invention. The suspensionassembly component 800 includes a mounting plate portion 820 and amicroactuator mounting structure 801 extending from the mounting plateportion 820. In the embodiment of FIG. 8, the mounting plate portion 820and the microactuator mounting structure 801 are shown to be a singlecomponent having material continuity rather than being an assembly ofsubcomponents.

In the embodiment of FIG. 8, the microactuator mounting structure 801includes a partially etched well 840 into which a microactuator may beplaced. The microactuator mounting structure 801 includes at least onecompliant arm 810 so that a microactuator can move a distal portion 818relative to an anchored portion 816 of the microactuator mountingstructure 801. For example, in the embodiment of FIG. 8, themicroactuator mounting structure 801 includes two compliant arms 810 and812, so that the microactuator mounting structure encompasses a window814. The window 814 is dimensioned so that it can be spanned by amicroactuator.

In the embodiment of FIG. 8, the distal portion 818 of the microactuatormounting structure 801 includes a stainless steel surface having tworegions 850 and 852 that are coated with gold. Alternatively, one ormore gold coatings can be disposed on a stainless steel surface of themounting plate portion 820, for example outside but adjacent theanchored portion 816 of the microactuator mounting structure 801. Ineither of these alternative embodiments, what is desired is that thegold coatings be disposed near enough to the partially etched well 840to facilitate electrical connection to a microactuator placed therein.Preferably but not necessarily, the two gold-coated regions 850 and 852of the stainless steel surface of the microactuator mounting structure801 include partial etched trenches 860 and 862, respectively, which mayincrease the reliability of electrical connections made thereto. In theembodiment of FIG. 8, the distal portion 818 of the microactuatormounting structure 801 may optionally also include an adhesive-limitingtrench 870.

In the foregoing specification, the invention is described withreference to specific exemplary embodiments, but those skilled in theart will recognize that the invention is not limited to those. It iscontemplated that various features and aspects of the invention may beused individually or jointly and possibly in a different environment orapplication. The specification and drawings are, accordingly, to beregarded as illustrative and exemplary rather than restrictive.“Comprising,” “including,” and “having,” are intended to be open-endedterms.

1. A disk drive comprising: a disk drive base; a spindle attached to thedisk drive base; a disk mounted on the spindle; a coarse actuatorattached to the disk drive base, the coarse actuator including anactuator arm; a suspension assembly, the suspension assembly including asuspension assembly mounting plate attached to the actuator arm; amicroactuator mounting structure extending from the suspension assemblymounting plate; a load beam extending from the microactuator mountingstructure; and a laminated flexure attached to the load beam, thelaminated flexure including a tongue; wherein the suspension assemblyincludes a stainless steel surface having a gold coating, and furthercomprises a microactuator attached to the microactuator mountingstructure and electrically connected to the gold coating; and a readhead bonded to the tongue.
 2. The disk drive of claim 1 wherein thestainless steel surface is a stainless steel surface of themicroactuator mounting structure.
 3. The disk drive of claim 1 whereinthe stainless steel surface is a stainless steel surface of thesuspension assembly mounting plate.
 4. The disk drive of claim 1 whereinthe load beam includes at least one hinge plate and the stainless steelsurface is a stainless steel surface of the hinge plate.
 5. The diskdrive of claim 1 wherein the microactuator is electrically connected tothe gold coating with an epoxy adhesive that is doped with silverparticles.
 6. The disk drive of claim 1 wherein the laminated flexureincludes a structural layer, a dielectric layer, and a conductive layerthat defines a plurality of conductive traces, and wherein the read headis electrically connected to more than one of the plurality ofconductive traces.
 7. The disk drive assembly of claim 6 wherein themicroactuator includes two piezoelectric elements, and wherein each ofthe two piezoelectric elements is electrically connected to at least oneof the plurality of conductive traces.
 8. The disk drive of claim 6wherein the microactuator includes one piezoelectric element, andwherein the piezoelectric element is electrically connected to two ofthe plurality of conductive traces.
 9. The disk drive of claim 6 whereinthe microactuator includes one piezoelectric element, and wherein thepiezoelectric element is electrically connected to only one of theplurality of conductive traces.
 10. The disk drive of claim 1 whereinmicroactuator mounting structure and the suspension assembly mountingplate are a single component having material continuity rather thanbeing an assembly of subcomponents.
 11. The disk drive of claim 1wherein the microactuator mounting structure is attached to suspensionassembly mounting plate by a plurality of spot welds.
 12. A suspensionassembly comprising: a suspension assembly mounting plate; amicroactuator mounting structure extending from the suspension assemblymounting plate; a load beam extending from the microactuator mountingstructure; and a laminated flexure attached to the load beam, thelaminated flexure including a tongue that has a read head bondingsurface; wherein the suspension assembly includes a stainless steelsurface having a gold coating, and further comprises a microactuatorattached to the microactuator mounting structure and electricallyconnected to the gold coating.
 13. The suspension assembly of claim 12wherein the stainless steel surface is a stainless steel surface of themicroactuator mounting structure.
 14. The suspension assembly of claim12 wherein the stainless steel surface is a stainless steel surface ofthe suspension assembly mounting plate.
 15. The suspension assembly ofclaim 12 wherein the load beam includes at least one hinge plate and thestainless steel surface is a stainless steel surface of the hinge plate.16. The suspension assembly of claim 15 wherein the at least one hingeplate and the load beam are a single component having materialcontinuity rather than being an assembly of subcomponents.
 17. Thesuspension assembly of claim 15 wherein the at least one hinge plate isattached to the load beam by a plurality of spot welds.
 18. Thesuspension assembly of claim 13 wherein the microactuator mountingstructure and the suspension assembly mounting plate are a singlecomponent having material continuity rather than being an assembly ofsubcomponents.
 19. The suspension assembly of claim 13 wherein themicroactuator mounting structure is attached to the suspension assemblymounting plate by a plurality of spot welds.
 20. The suspension assemblyof claim 12 wherein the microactuator is electrically connected to thegold coating with an epoxy adhesive that is doped with silver particles.21. The suspension assembly of claim 12 wherein the laminated flexureincludes a structural layer, a dielectric layer, and a conductive layerthat defines a plurality of conductive traces.
 22. The suspensionassembly of claim 21 wherein the microactuator includes twopiezoelectric elements, and wherein each of the two piezoelectricelements is electrically connected to at least one of the plurality ofconductive traces.
 23. The suspension assembly of claim 21 wherein themicroactuator includes one piezoelectric element, and wherein thepiezoelectric element is electrically connected to only one of theplurality of conductive traces.
 24. The suspension assembly of claim 12further comprising at least one partial etched trench in the stainlesssteel surface that has the gold coating.
 25. A head gimbal assembly(HGA) comprising: a suspension assembly, the suspension assemblyincluding a suspension assembly mounting plate; a microactuator mountingstructure extending from the suspension assembly mounting plate; a loadbeam extending from the microactuator mounting structure; and alaminated flexure attached to the load beam, the laminated flexureincluding a tongue; wherein the suspension assembly includes a stainlesssteel surface having a gold coating, and further comprises amicroactuator attached to the microactuator mounting structure andelectrically connected to the gold coating; and a read head bonded tothe tongue.
 26. The HGA of claim 25 wherein the stainless steel surfaceis a stainless steel surface of the microactuator mounting structure.27. The HGA of claim 25 wherein the stainless steel surface is astainless steel surface of the suspension assembly mounting plate. 28.The HGA of claim 25 wherein the load beam includes at least one hingeplate and the stainless steel surface is a stainless steel surface ofthe hinge plate.
 29. The HGA of claim 25 wherein the microactuatormounting structure and the suspension assembly mounting plate are asingle component having material continuity rather than being anassembly of subcomponents.
 30. The HGA of claim 25 wherein themicroactuator mounting structure is attached to the suspension assemblymounting plate by a plurality of spot welds.